Meeting the requirements in future semiconductor fabrication processes
Atomic Layer Deposition (ALD) enabled corrosion protection solutions against plasma etch are becoming more sought after in the semiconductor industry. Current wafer fabrication process flows include several steps where plasma etching is necessary. An inevitable consequence of using such strong etching chemicals is that the tool itself will be etched. This tool damage can be managed by applying a corrosion-resistant coating to the etch tool to minimize plasma damage.
Our approach is to combine the highly-etch-resistant Y
2O
3 ALD process with more robust ALD processes, such as Al
2O
3 or ZrO
2. It has been shown that to gain most of the benefits from Y
2O
3 its molar concentration can be less than half in a composite oxide.
Watch the 10 minute webinar where we demonstrate that a high performance ALD corrosion barrier deposition with the speed and convenience of Al
2O
3 process and durability of Y
2O
3 can be achieved by carefully controlling the film composition, and that the process is transferrable to an industrial scale deposition chamber.
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