Foldable phones are now a commercially available product‚ with some manufacturers already several generations into the product cycle. Use of thin film encapsulation solutions (TFEs) in organic electronic manufacturing (OEM) has become more common as they are lighter and enable folding and stretching of a device‚ unlike conventional encapsulation methods. The commercial demand has created a large driving force to develop the quality‚ reliability‚ and process flow integration of TFEs to enable future product iterations. Inorganic films‚ such as those generally associated with atomic layer deposition (ALD) are vital building blocks for electronic devices due to the variety of properties they offer to a fabrication scheme. One of the main reliability issues TFEs face is that inorganic films are susceptible to crack under mechanical stress‚ compromising the barrier performance and cutting the lifetime of the device short.
One approach to address this issue is the nanolamination of dense inorganic layers deposited with ALD for enhanced barrier performance‚ with organic or hybrid molecular layer deposition (MLD) layers to offer enhanced flexibility.
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